![]() ![]() For this reason, a profiler should be used with thermocouples mounted to monitor the temperature at various critical points throughout the process to ensure the temperatures achieved enable reflow of the solder paste. ![]() In order to adjust a profile you need to understand what’s happening on the PCB. The PCB you are processing may require small variations from the manufacturer’s suggested reflow profile to enable achievement of acceptable quality levels. Guidance is always provided by the solder paste manufacturer and should be used as exactly that. The reason being is that the boiling point of the chemical used is constant and every part of the printed circuit board (PCB) assembly benefits from the same temperature.Īchieving a reflow profile that is suited to both the solder paste and the components used is absolutely critical to the success of the surface mount process. Vapour phase technology has also enjoyed similar success in the development of reflow soldering and is popular with certain lead-free process requirements. Infrared ovens have made leaps and bounds in the last thirty years to achieve fantastic results but nowadays many manufacturers use forced air convection ovens to reflow the solder paste. When surface mount began, the heat sources employed were infrared.
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